Litcius/Paper detail

Thermal conductivity enhancement of aluminum scandium nitride grown by molecular beam epitaxy

Gustavo A. Alvarez, Joseph Casamento, Len van Deurzen, Md Irfan Khan, Kamruzzaman Khan, Eugene Jeong, Elaheh Ahmadi, Huili Grace Xing, Debdeep Jena, Zhiting Tian

2023Materials Research Letters18 citationsDOIOpen Access PDF

Abstract

Aluminum scandium nitride (AlScN) has been receiving increasing interest for radio frequency microelectromechanical systems because of their higher achievable bandwidths owing to the larger piezoelectric response of AlScN compared to AlN. However, alloying scandium (Sc) with aluminum nitride (AlN) significantly lowers the thermal conductivity of AlScN due to phonon alloy scattering. Self-heating in AlScN devices potentially limits power handling, constrains the maximum transmission rate, and ultimately leads to thermal failure. We grew plasma-assisted molecular beam epitaxy (PAMBE) AlScN on AlN-Al2O3 and GaN-Al2O3 substrates, and compared the cross-plane thermal conductivity to current work on AlScN grown on Si substrates.

Topics & Concepts

Materials scienceScandiumMolecular beam epitaxyNitrideThermal conductivityOptoelectronicsPhonon scatteringAluminium nitrideAluminiumGallium nitrideEpitaxyComposite materialMetallurgyLayer (electronics)GaN-based semiconductor devices and materialsAcoustic Wave Resonator TechnologiesThermal properties of materials