Litcius/Paper detail

Sub-surface Damage of Ultra-Thin Monocrystalline Silicon Wafer Induced by Dry Polishing

Xundi Zhang, Chenlin Yang, Yumei Zhang, Anmin Hu, Ming Li, Liming Gao, Huiqin Ling, Tao Hang

2020Electronic Materials Letters17 citationsDOI

Topics & Concepts

WaferPolishingMaterials scienceGrindingMonocrystalline siliconChemical-mechanical planarizationOptoelectronicsComposite materialSiliconAdvanced Surface Polishing TechniquesIntegrated Circuits and Semiconductor Failure AnalysisAdvanced machining processes and optimization
Sub-surface Damage of Ultra-Thin Monocrystalline Silicon Wafer Induced by Dry Polishing | Litcius