Litcius/Paper detail

Microstructure refinement, thermodynamic characteristic, wettability and shear strength of Bi-added rapid solidification SAC305 solder

Zhiyong Long, Shengfa Liu, Li Liu, Yingzhen Tan, Zhen Wang, Xinbiao Wang

2022Journal of Materials Science Materials in Electronics12 citationsDOI

Topics & Concepts

Materials scienceMicrostructureSolderingNucleationWettingEquiaxed crystalsIntermetallicSupercoolingEutectic systemComposite materialShear strength (soil)MetallurgySurface energyPhase (matter)AlloyThermodynamicsSoil waterPhysicsSoil scienceEnvironmental scienceOrganic chemistryChemistryElectronic Packaging and Soldering TechnologiesAluminum Alloy Microstructure PropertiesAluminum Alloys Composites Properties