Effects of suppressors on the incorporation of impurities and microstructural evolution of electrodeposited Cu solder joints
You-Jhen Su, Kun-Lin Tsai, Yu-Ju Li, Chih‐Ming Chen
Topics & Concepts
Materials scienceImpurityPlating (geology)Isothermal processOxideLayer (electronics)Chemical engineeringElectroplatingAdsorptionSolderingTin oxideDesorptionTinDeposition (geology)CopperPolyethylene glycolMetallurgyComposite materialOrganic chemistryChemistryPaleontologyGeologyEngineeringBiologyThermodynamicsSedimentGeophysicsPhysicsElectrodeposition and Electroless CoatingsElectronic Packaging and Soldering TechnologiesCopper Interconnects and Reliability