Performance and Reliability of Advanced CW Lasers for Silicon Photonics Applications
John E. Johnson, K. Bacher, Rebecca K. Schaevitz, Vivek Raghunathan
Abstract
Co-Packaged Optics (CPO) using Silicon Photonics Chiplets in Package (SCIP) is an essential technology for flattening the power consumption curve for Networking and Compute applications in Hyperscale Datacenters. CW lasers are integral to the operation of these systems and are an important part of the power solution. This talk will review the impact of advanced CW lasers on the architecture, performance, efficiency and reliability of CPO systems.
Topics & Concepts
PhotonicsReliability (semiconductor)Silicon photonicsFlatteningLaserSiliconComputer scienceMaterials sciencePower consumptionPower (physics)OptoelectronicsElectronic engineeringEngineeringOpticsPhysicsComposite materialQuantum mechanicsPhotonic and Optical DevicesSemiconductor Lasers and Optical DevicesOptical Network Technologies