Material removal rate model for chemical–mechanical polishing of single-crystal SiC substrates using agglomerated diamond abrasive
Pengfei Wu, Ning Liu, Xue Li, Yongwei Zhu
Topics & Concepts
AbrasivePolishingChemical-mechanical planarizationMaterials scienceDiamondSlurryComposite materialSingle crystalCrystal (programming language)Substrate (aquarium)MetallurgyCrystallographyChemistryComputer scienceOceanographyGeologyProgramming languageAdvanced Surface Polishing TechniquesDiamond and Carbon-based Materials ResearchAdvanced machining processes and optimization