Design and fabrication of through-glass via (TGV) based 3D spiral inductors in fused silica substrate
Harindra Kumar Kannojia, Aboobackkar Sidhique, Ambika Shanker Shukla, Jaising Pednekar, Shalabh Gupta, Pradeep Dixit
Topics & Concepts
Materials scienceInductorFabricationInductancePhotoresistElectromagnetic coilOptoelectronicsOhmic contactQ factorSubstrate (aquarium)Composite materialElectrical engineeringLayer (electronics)ResonatorMedicineOceanographyPathologyEngineeringVoltageGeologyAlternative medicineAdvanced Machining and Optimization TechniquesSemiconductor materials and devices3D IC and TSV technologies