Litcius/Paper detail

Hierarchical multi-porous copper structure prepared by dealloying electrolytic copper-manganese alloy

Soyoung Joo, Yunju Choi, Heon‐Cheol Shin

2021Journal of Alloys and Compounds10 citationsDOI

Topics & Concepts

ElectroplatingCopperMaterials scienceMesoporous materialPorosityElectrochemistryManganesePlating (geology)AlloyChemical engineeringElectrolyteLayer (electronics)MetallurgyCopper platingDeposition (geology)NanotechnologyChemistryElectrodeComposite materialCatalysisGeologyGeophysicsSedimentPaleontologyBiochemistryEngineeringPhysical chemistryNanoporous metals and alloysElectrocatalysts for Energy ConversionSupercapacitor Materials and Fabrication
Hierarchical multi-porous copper structure prepared by dealloying electrolytic copper-manganese alloy | Litcius