Residual stress distribution of silicon wafers machined by rotational grinding based on molecular dynamics
Haijun Liu, Qilong Zhang, Jing Zhou, Xiaoqing Tian, Shan Chen, Fangfang Dong, Jiang Han
Topics & Concepts
Materials scienceResidual stressGrindingWaferMolecular dynamicsComposite materialSiliconDynamics (music)MetallurgyNanotechnologyComputational chemistryPhysicsAcousticsChemistryAdvanced Surface Polishing TechniquesAdvanced machining processes and optimizationLaser Material Processing Techniques