Litcius/Paper detail

Microstructure and strength of diffusion bonding W alloy/304 stainless steel joint using a Cu interlayer

Huai Sun, Yong Han, Yuan Li

2023International Journal of Refractory Metals and Hard Materials19 citationsDOI

Topics & Concepts

Materials scienceDiffusion bondingMicrostructureIntermetallicAlloyComposite materialUltimate tensile strengthMetallurgyJoint (building)Solid solution strengtheningSolid solutionIntergranular fractureBrittlenessLattice diffusion coefficientIntergranular corrosionStructural engineeringEffective diffusion coefficientMedicineMagnetic resonance imagingEngineeringRadiologyAdvanced materials and compositesFusion materials and technologiesAdvanced Welding Techniques Analysis