Analysis of hotspots and cooling strategy for multilayer three-dimensional integrated circuits
Chao Wang, Xiao-Jie Huang, Kambiz Vafai
Topics & Concepts
Hotspot (geology)Materials scienceCoolantReynolds numberNusselt numberChipThree-dimensional integrated circuitHeat transferThrough-silicon viaThermalMechanicsSiliconIntegrated circuitMechanical engineeringOptoelectronicsThermodynamicsElectrical engineeringPhysicsEngineeringTurbulenceGeophysics3D IC and TSV technologiesElectronic Packaging and Soldering TechnologiesSilicon Carbide Semiconductor Technologies