Grain boundary evolution and effect on electrical conductivity of Cu Ti alloys prepared by accumulative roll bonding-diffusion alloying process
Yingming Tu, Xue-Feng Liu, Wenjing Wang, Weiliang Zhang, Qihang Feng
Topics & Concepts
Grain boundaryMaterials scienceGrain boundary diffusion coefficientAnnealing (glass)Accumulative roll bondingGrain boundary strengtheningElectrical resistivity and conductivityAlloyDeformation (meteorology)Grain growthMetallurgyGrain sizeCondensed matter physicsComposite materialMicrostructureElectrical engineeringEngineeringPhysicsMicrostructure and mechanical propertiesAluminum Alloys Composites PropertiesAdvanced Welding Techniques Analysis