Integrated acoustic resonators in commercial fin field-effect transistor technology
Jackson Anderson, Yanbo He, Bichoy Bahr, Dana Weinstein
Abstract
Abstract In radio communication, the growth of beamforming and multiple-input–multiple-output technologies, which increase transceiver complexity, have led to a drive to reduce the size, weight and power of radio components by integrating them into a single system on chip. One approach is to integrate the frequency references of acoustic microelectromechanical systems (MEMS) with complementary metal–oxide–semiconductor processes, typically through a MEMS-first or MEMS-last approach that requires process customization. Here we report unreleased acoustic resonators that are fabricated in 14 nm fin field-effect transistor technology and operate in the X-band frequency range (8–12 GHz). The devices use phononic waveguides for acoustic confinement and exploit metal–oxide–semiconductor capacitors and transistors to electromechanically drive and sense acoustic vibrations. Fifteen device variations are analysed across 30 bias points, quantifying the importance of phononic confinement on resonator performance and demonstrating the velocity-saturated piezoresistive effect in active resonant transistors. Our results illustrate the feasibility of integrating acoustic devices directly into standard complementary metal–oxide–semiconductor processes.