Innovative Smart Cut™ Piezo On Insulator (POI) Substrates for 5G acoustic filters
E. Butaud, S. Ballandras, Marie Bousquet, A. Drouin, B. Tavel, Isabelle Huyet, Alexandre Clairet, Isabelle Bertrand, Aymen Ghorbel, Alexandre Reinhardt
Abstract
5G standards implementation drive significant challenges at the acoustic filter level and requires innovative solutions. A promising approach relies in Surface Acoustic Waves technology combined with a thin LiTaO3 piezoelectric crystal layer bonded on Silicon substrate - so called POI-substrate, but suffers from volume manufacturing solution. We will report how Smart Cut™ layer transfer technology enables it.
Topics & Concepts
Materials sciencePiezoelectricitySubstrate (aquarium)Layer (electronics)AcousticsSurface acoustic waveAcoustic waveSiliconFilter (signal processing)Silicon on insulatorComputer scienceElectronic engineeringOptoelectronicsEngineeringElectrical engineeringComposite materialPhysicsOceanographyGeologyAcoustic Wave Resonator TechnologiesUltrasonics and Acoustic Wave PropagationMicrowave Engineering and Waveguides