Tributyl(hexyl)phosphonium chloride as a new leveler for microvia copper superconformal electronic plating
Tao Song, Zhao‐Yun Wang, Jiaqiang Yang, Yi Zhao, Fang‐Zu Yang, Dongping Zhan, Dongping Zhan
Topics & Concepts
ChemistryPhosphoniumChlorideCopperCopper platingPlating (geology)Inorganic chemistryPolymer chemistryOrganic chemistryGeologyLayer (electronics)ElectroplatingGeophysicsElectrodeposition and Electroless CoatingsCopper Interconnects and ReliabilityMolecular Junctions and Nanostructures