A 120-Gb/s 100–145-GHz 16-QAM Dual-Band Dielectric Waveguide Interconnect With Package Integrated Diplexers in Intel 16
Georgios C. Dogiamis, Thomas W. Brown, Neelam Prabhu Gaunkar, Ye Seul Nam, Triveni S. Rane, Surej Ravikumar, Vijaya B. Neeli, Jessica C. Chou, Said Rami, Johanna Swan
Abstract
This paper presents a dual-band superheterodyne transceiver system in Intel 16 operating at 109 and 135 GHz center frequencies with a measured rejection >60dB within the 11 GHz guard band. The transceiver is flip-chip assembled on a multilayer organic package, which integrates hairpin resonator diplexers and electromagnetic waveguide launchers. A connector assembled on the organic package feeds a 3-4 m long PTFE dielectric waveguide ensuring a stable mechanical connection. This paper demonstrates up to 120 Gbps data rates with measured EVMs between -19.2 dB to -16.2 dB at 3-4 m distances with combined power consumption of 1116 mW. This is the first work in literature reporting beyond 60 Gbps over dielectric waveguide channels at link distances greater than 1 meter. Combing frequency division multiplexing with a low tap count FFE equalizer and sharp on-die analog and RF filtering with a low loss on package diplexer enabled the >100 Gbps at multi-meter distances.