Composite surfactant based on AEO and ADS for colloidal silica particles removal in post CMP cleaning of copper interconnection
Yang Liu, Da Yin, Wenqian Zhang, Tiecheng Han, Peng Zhao, Tongju Wang, Li-Min Cheng
Topics & Concepts
Materials scienceAdsorptionColloidal silicaCopperPulmonary surfactantComposite numberChemical engineeringWaferColloidSurface roughnessParticle (ecology)Economies of agglomerationSurface finishPenetration (warfare)Composite materialNanotechnologyMetallurgyChemistryOrganic chemistryCoatingOperations researchGeologyEngineeringOceanographyAdvanced Surface Polishing TechniquesAdvanced Machining and Optimization TechniquesAdvanced machining processes and optimization