Comparison of thermal-fatigue lives of conventional and hybrid solder joints: Experiment and FE analysis
Geun-Je Park, Dongmin Jang, Jin-Woo Jang, Jae-Seok Jang, Jae-Yoon Jeong, Yun-Jae Kim
Topics & Concepts
Materials scienceSolderingDissipationComposite materialCreepFracture mechanicsStructural engineeringThermalFatigue testingEngineeringMeteorologyThermodynamicsPhysicsElectronic Packaging and Soldering TechnologiesHigh Temperature Alloys and CreepAdvanced Welding Techniques Analysis