Thermomechanical fatigue lifetime evaluation of solder joints in power semiconductors using a novel energy based modeling
Buen Zhang, Noor H. Jabarullah, Ayad F. Alkaim, Svetlana Danshina, I. V. Krasnopevtseva, Zheng Yuan, Nisith Geetha
Abstract
Purpose This paper aims to establish a more accurate model for lifetime estimation. Design/methodology/approach Finite element model simulation and experimental tests are used to enhance the lifetime prediction model of the solder joint. Findings A more precise model was found. Originality/value It is confirmed that the paper is original.
Topics & Concepts
SolderingFinite element methodJoint (building)Structural engineeringReliability engineeringMaterials sciencePower (physics)Energy (signal processing)Mechanical engineeringEngineeringMetallurgyMathematicsThermodynamicsPhysicsStatisticsElectronic Packaging and Soldering TechnologiesSilicon Carbide Semiconductor TechnologiesAluminum Alloys Composites Properties