Diffusion reaction-induced microstructure and strength evolution of Cu joints bonded with Sn-based solder containing Ni-foam
He Huang, Shangyu Huang, Yong Xiao, Russell Goodall
Topics & Concepts
SolderingMaterials scienceMicrostructureShear strength (soil)Composite materialPorosityMelting pointComposite numberPhase (matter)DiffusionDiffusion barrierMetallurgyLayer (electronics)ThermodynamicsSoil waterPhysicsSoil scienceOrganic chemistryEnvironmental scienceChemistryElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAdvanced Welding Techniques Analysis