Influence of diamond content and milling duration on microstructure and thermal conductivity of Ti-coated diamond/copper composite coating on copper substrate
Jing Sun, Jiajun Zang, Huan Li, Xiaomei Feng, Yifu Shen
Topics & Concepts
DiamondMaterials scienceMicrostructureThermal conductivityCopperMetallurgyCoatingComposite numberVolume fractionWettingAnnealing (glass)Composite materialMaterial properties of diamondAluminum Alloys Composites PropertiesAdvanced materials and compositesDiamond and Carbon-based Materials Research