Equivalent thermal model of through silicon via and bump for advanced packaging of integrated circuits
Chuanjun Nie, Qinzhi Xu, Lan Chen
Topics & Concepts
Through-silicon viaThermalThermal conductivityFinite element methodMaterials scienceEquivalent circuitIntegrated circuitThermal resistanceConsistency (knowledge bases)Three-dimensional integrated circuitElectronic engineeringAnisotropySiliconElectronic circuitChipMechanical engineeringEngineeringStructural engineeringComputer scienceOptoelectronicsComposite materialElectrical engineeringThermodynamicsPhysicsOpticsArtificial intelligenceVoltage3D IC and TSV technologiesElectronic Packaging and Soldering TechnologiesAdditive Manufacturing and 3D Printing Technologies