Finite element modeling and analysis method for predicting and optimizing the warpage of construction before flip chip bonding in System-on-Wafer process flow
Yuanxing Duan, Guandong Liu, Weihao Wang, Qingwen Deng, Jie Li, Rong Cao, Chuanzhi Wang
Topics & Concepts
WaferFlip chipFinite element methodChipMechanical engineeringMolding (decorative)Process (computing)Die (integrated circuit)Reliability (semiconductor)Wafer fabricationEngineeringEngineering drawingMaterials scienceComputer scienceStructural engineeringPower (physics)Composite materialElectrical engineeringLayer (electronics)AdhesiveQuantum mechanicsOperating systemPhysics3D IC and TSV technologiesElectronic Packaging and Soldering TechnologiesAdditive Manufacturing and 3D Printing Technologies