Nanoprecipitates induced dislocation pinning and multiplication strategy for designing high strength, plasticity and conductivity Cu alloys
Huiya Yang, Keqiang Li, Yeqiang Bu, Jin‐Ming Wu, Youtong Fang, Liang Meng, Jiabin Liu, Hongtao Wang
Topics & Concepts
Materials scienceDislocationPrecipitationAlloyPlasticityUltimate tensile strengthConductivityElongationTransmission electron microscopyElectrical resistivity and conductivityMetallurgyComposite materialCondensed matter physicsNanotechnologyPhysical chemistryChemistryMeteorologyElectrical engineeringEngineeringPhysicsMicrostructure and mechanical propertiesAluminum Alloys Composites PropertiesAluminum Alloy Microstructure Properties