Litcius/Paper detail

Modeling and prediction on grinding force in ultrasonic assisted elliptical vibration grinding (UAEVG) of SiC ceramics using single diamond grain

Kun Zhang, Chenwei Dai, Zhen Yin, Qing Miao, Jiajia Chen, Qihui Cheng, Shengjun Yang

2024Journal of Manufacturing Processes22 citationsDOI

Topics & Concepts

Materials scienceGrindingDiamondCeramicVibrationDiamond grindingComposite materialMetallurgyGrain sizeAcousticsGrinding wheelPhysicsAdvanced Surface Polishing TechniquesAdvanced machining processes and optimizationAdvanced Machining and Optimization Techniques