Low-temperature sintering ZTA ceramics with CuO–TiO <sub>2</sub> –Nb <sub>2</sub> O <sub>5</sub> composite oxide sintering aids for LTCC applications
S. Si, Mingsheng Ma, Faqiang Zhang, Feng Liu, Jingjing Feng, J.J. Bian, Zhifu Liu
Abstract
Zirconia-toughened alumina (ZTA) ceramics have attracted much attention as electronic package substrate materials due to their excellent mechanical properties and chemical stability. The high sintering temperatures of ZTA ceramics has restricted their multilayer co-firing with copper electrodes for low-temperature co-fired ceramics (LTCC) applications. In order to strike a balance between good properties and lower sintering temperatures, this work proposes CuO–TiO<sub>2</sub>–Nb<sub>2</sub>O<sub>5</sub> (CTN) composite oxide sintering aids for ZTA ceramics to obtain a novel glass-free LTCC material. The low-temperature densification mechanism based on multiphase synergy and interfacial reaction is revealed. The results show that the sintering temperature of ZTA ceramics doped with 5 wt% CTN can be significantly reduced to 1050 °C, meanwhile exhibiting high thermal conductivity (18.7 W/m·K), high bending strength (405 MPa), and low dielectric loss (9.97 × 10<sup>-4</sup> @11.97 GHz). The co-firing compatibility with multilayer copper inner electrode is also demonstrated. This work overcomes the traditional trade-off between low-temperature sintering and high performance in glass-free LTCC materials, and also provides a new strategy for the design and development of multilayer ceramic substrates with copper inner electrodes.