Evaluation of thermal conductivity for sintered silver considering aging effect with microstructure based model
Fei Qin, Yuankun Hu, Yanwei Dai, Tong An, Pei Chen
Topics & Concepts
Thermal conductivityMaterials scienceThermal conductionMicrostructurePorosityComposite materialThermalHeat fluxThermodynamicsHeat transferPhysicsElectronic Packaging and Soldering TechnologiesThermal properties of materialsAdhesion, Friction, and Surface Interactions