Experimental study on uniformity of copper layer with microstructure arrays by electroforming
Yongfei Zhao, Shuangqing Qian, Yong Zhang, Xiaofeng Wan, Hua Zhang
Topics & Concepts
ElectroformingMaterials scienceMicrostructureFabricationCopperVoid (composites)Layer (electronics)Composite materialOptoelectronicsDuty cycleCurrent densityMetallurgyElectrical engineeringVoltageAlternative medicineEngineeringMedicinePhysicsPathologyQuantum mechanicsElectrodeposition and Electroless CoatingsElectronic Packaging and Soldering TechnologiesCopper Interconnects and Reliability