Research on sintering process and thermal conductivity of hybrid nanosilver solder paste based on molecular dynamics simulation
Zhongqing Zhang, Guicui Fu, Bo Wan, Yutai Su, Maogong Jiang
Topics & Concepts
Materials scienceSinteringThermal conductivitySolderingThermalComposite materialMolecular dynamicsConductivityMetallurgyNanotechnologyThermodynamicsChemistryPhysicsComputational chemistryPhysical chemistrynanoparticles nucleation surface interactionsNanomaterials and Printing TechnologiesThermal properties of materials