Optimization of die design parameters in ECAP for sustainable manufacturing using response surface methodology
Krishna Mohan Agarwal, Priyanka Singh, Saurav Dixit, Meshcheryakova Tatiana Sergeevna, Olga Soloveva, Sergei Solovev, Kaushal Kumar
Topics & Concepts
PressingResponse surface methodologyDie (integrated circuit)Materials scienceAerospaceShear (geology)Mechanical engineeringChannel (broadcasting)Structural engineeringComposite materialEngineeringMathematicsStatisticsNanotechnologyElectrical engineeringAerospace engineeringMetal Forming Simulation TechniquesMicrostructure and mechanical propertiesMetallurgy and Material Forming