Modeling the cure shrinkage–induced warpage of epoxy molding compound
Chang‐Chun Lee, Hao-Zhou Lin
Topics & Concepts
ShrinkageMaterials scienceEpoxyComposite materialCuring (chemistry)ViscoelasticityIsothermal processImage warpingMolding (decorative)CreepFinite element methodStructural engineeringComputer scienceThermodynamicsEngineeringArtificial intelligencePhysicsEpoxy Resin Curing ProcessesInjection Molding Process and PropertiesElectronic Packaging and Soldering Technologies