Research progress of hybrid bonding technology for three-dimensional integration
Anqi Zhou, Yu Zhang, Fei Ding, Ziqi Lian, Renxi Jin, Yudong Yang, Qidong Wang, Liqiang Cao
Topics & Concepts
EngineeringManufacturing engineeringComputer scienceAdvanced Surface Polishing Techniques3D IC and TSV technologiesManufacturing Process and Optimization