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A 200-GHz Power Amplifier With 18.7-dBm <i>P</i> <sub>sat</sub> in 45-nm CMOS SOI: A Model-Based Large-Signal Approach on Cascaded Series-Connected Power Amplification

Saleh Hassanzadehyamchi, Amirreza Alizadeh, Ali M. Niknejad, Omeed Momeni

2023IEEE Journal of Solid-State Circuits12 citationsDOI

Abstract

This article proposes a novel approach on cascaded series-connected power amplifier (PA) design. High-frequency transistor modeling is employed to analyze the stacked cell, and a methodology is developed to maximize the output power ( <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$P_\text{out}$</tex-math> </inline-formula> ) and power-added efficiency (PAE) of each cell. The <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$P_\text{out}$</tex-math> </inline-formula> and power gain of the cell are studied, and the optimum operation point is determined. A proof-of-concept integrated PA is implemented in a 45-nm CMOS silicon-on-insulator (SOI) process, where stacking and parallel power combining techniques are adopted to achieve 18.7-dBm <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$P_\text{out}$</tex-math> </inline-formula> and 4.8% PAE at 200 GHz. Each PA unit uses three cascaded gain stages where two-stacked, three-stacked, and five-stacked architectures are employed for the first, second, and third stages, respectively. Four PA units are power-combined by a low-loss 4:1 zero-degree combiner. The amplifier consumes 1.4-W dc power and has a small-signal gain of 14.6 dB at 203.2 GHz. The designed PA occupies <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$1.28\times1.05$</tex-math> </inline-formula> mm <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$^\text{2}$</tex-math> </inline-formula> die area, including all pads. To the author’s knowledge, the designed PA achieves the highest <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$P_\text{out}$</tex-math> </inline-formula> and PAE among all the Si counterparts at 200 GHz.

Topics & Concepts

AmplifierCMOSSilicon on insulatorPower (physics)Electrical engineeringComputer scienceTopology (electrical circuits)Electronic engineeringPhysicsOptoelectronicsEngineeringSiliconQuantum mechanicsAdvanced Power Amplifier DesignRadio Frequency Integrated Circuit DesignElectromagnetic Compatibility and Noise Suppression