Size-on-demand preparation of SAC305 solder balls based on pulsated orifice ejection method
Wei Dong, Zanru Jia, Xudong Wang, Fumin Xu, Yang Zhao
Topics & Concepts
Materials scienceSolderingDrop (telecommunication)Body orificeBall grid arraySolder pasteMicrostructureComposite materialMechanical engineeringEngineeringNanomaterials and Printing TechnologiesElectronic Packaging and Soldering TechnologiesFluid Dynamics and Thin Films