Effect of Cu on the interfacial reaction between Sn-based solders and FeCoNiCu alloys
Yu-An Shen, Xiumei Yang, Cheng‐Yu Tsai, Yu-Hung Ouyang, Ming‐Hung Tsai, Tao-Tsung Shun
Topics & Concepts
IntermetallicMaterials scienceSolderingMetallurgyAlloyElectronic Packaging and Soldering Technologies3D IC and TSV technologiesMetallurgical and Alloy Processes