High mobility of IGO/IGZO double-channel thin-film transistors by atomic layer deposition
Pan Wen, Cong Peng, Zihui Chen, Xingwei Ding, Fa‐Hsyang Chen, Guowen Yan, Lin Xu, Dejian Wang, Xiaoqi Sun, Longlong Chen, Junfeng Li, Xifeng Li, Jianhua Zhang
Abstract
In this paper, top-gate thin-film transistors (TFTs) of two stacked double-channel layers derived from atomic layer deposition in combination with the plasma-enhanced chemical vapor deposition (PECVD) process were fabricated. The Hall measurement shows that the Hall mobility of the indium gallium oxide (IGO)/indium gallium zinc oxide (IGZO) active layer is 1.6 times more that of the amorphous In-rich IGZO/IGZO layer due to superior carrier percolation conduction paths from the polycrystalline IGO layer. Furthermore, x-ray photoelectron spectroscopy analysis indicates that the IGO/IGZO film has much less oxygen vacancy concentration, which is advantageous in improving not only mobility but also stability. The optimized IGO/IGZO TFT showed both high mobility (38.0 cm2 V−1 s−1) and high stability (ΔVTH = +0.14 V) of a positive bias stress under post-deposition annealing at 250 °C. This strategy provides a feasible process for realizing high-performance TFTs that is compatible with ALD-derived oxides and commercial PECVD techniques in the industry.