Litcius/Paper detail

Thermal management of GaN HEMT devices using subcooled flow boiling in an embedded manifold microchannel heat sink

Weiyu Tang, Junye Li, Junliang Lu, Kuang Sheng, Zan Wu, Xinbao Li, Xinbao Li

2023Applied Thermal Engineering56 citationsDOI

Topics & Concepts

Materials scienceSubcoolingHeat sinkHeat fluxPressure dropHeat transferMicrochannelMechanicsHeat transfer coefficientNucleate boilingThermodynamicsNanotechnologyPhysicsHeat Transfer and OptimizationHeat Transfer and Boiling StudiesFluid Dynamics and Thin Films