Experiment and theoretical prediction for subsurface microcracks and damage depth of multi-crystalline silicon wafer in diamond wire sawing
Xinying Li, Yufei Gao, Runtao Liu, Wei Zhou
Topics & Concepts
AbrasiveMaterials scienceWaferSiliconWafer dicingDiamondSlicingBrittlenessComposite materialBreakageSubstrate (aquarium)NanomanufacturingCrystal (programming language)Etching (microfabrication)MetallurgyOptoelectronicsMechanical engineeringNanotechnologyGeologyProgramming languageEngineeringLayer (electronics)OceanographyComputer scienceAdvanced Surface Polishing TechniquesAdvanced machining processes and optimizationTunneling and Rock Mechanics