Strengthening of copper with homogeneous dispersion of nanoscale tungsten particles fabricated by spark plasma sintering
Junsheng Ke, Zefeng Xie, Rui Liu, Rui Gao, X.P. Wang, Xuebang Wu, Jing Ke, Le Wang, Boyang Zhao, Q.F. Fang, C.S. Liu
Topics & Concepts
Materials scienceSpark plasma sinteringThermal conductivityTungstenCopperMicrostructureUltimate tensile strengthGrain sizeMetallurgyNanoparticleComposite materialNanoscopic scaleNanotechnologyAdvanced materials and compositesFusion materials and technologiesAluminum Alloys Composites Properties