Litcius/Paper detail

Flexible printed circuit board based on graphene/polyimide composites with excellent thermal conductivity and sandwich structure

Yu Wang, Huatao Wang, Fei Liu, Xulei Wu, Jinglong Xu, Hongxin Cui, Yajin Wu, Rui Xue, Cong Tian, Bojun Zheng, Yao Wang

2020Composites Part A Applied Science and Manufacturing48 citationsDOI

Topics & Concepts

Materials scienceComposite materialThermal conductivityPolyimideGrapheneMiniaturizationFlexible electronicsPrinted circuit boardThermal stabilityFabricationHeat spreaderEpoxyLayer (electronics)Heat sinkOptoelectronicsNanotechnologyMechanical engineeringElectrical engineeringPhysicsPathologyAlternative medicineMedicineQuantum mechanicsEngineeringThermal properties of materialsGraphene research and applicationsThermal Radiation and Cooling Technologies
Flexible printed circuit board based on graphene/polyimide composites with excellent thermal conductivity and sandwich structure | Litcius