Numerical modeling of low-temperature and low-pressure sintering of silver microparticles based on surface and grain boundary diffusion mechanisms
Xudong Wang, Lahouari Benabou
Abstract
In this article, the low-temperature (300 °C) sintering process of silver microparticles is modeled based on coupled diffusion mechanisms. Simulations are carried out for the simplest two-particle model and for various multiparticle arrangements. Sintering evolution was studied by evaluating densification, shrinkage rate, grain boundary growth under the effect of low uniaxial sintering pressure (1 to 5 bars). It is found that the gain provided by the applied pressure is limited to the grain boundary diffusion in the early stage of sintering. Sintering of a more complicated randomly-generated aggregate of 40 silver particles is also simulated.
Topics & Concepts
SinteringMaterials scienceGrain boundary diffusion coefficientGrain boundaryDiffusionSurface diffusionSurface (topology)Grain growthEffective diffusion coefficientMetallurgyMechanicsComposite materialGrain sizeThermodynamicsGeometryMicrostructureMathematicsChemistryMedicineOrganic chemistryAdsorptionPhysicsMagnetic resonance imagingRadiologyAluminum Alloys Composites PropertiesPowder Metallurgy Techniques and MaterialsMicrostructure and mechanical properties