PCB Soldering Defect Inspection Using Multitask Learning under Low Data Regimes
Sik‐Ho Tsang, Zhaoqing Suo, Tom Tak-Lam Chan, Huu-Thanh Nguyen, Daniel Pak-Kong Lun
Abstract
To increase the reliability of the printed circuit board (PCB) manufacturing process, automated optical inspection is often employed for soldering defect detection. However, traditional approaches built on handcrafted features, predefined rules, or thresholds are often susceptible to the variation of the acquired images’ quality and give unstable performances. To solve this problem, a deep learning‐based soldering defect detection method is developed in this article. Like many real‐life deep learning applications, the number of available training samples is often limited. This creates a challenging low‐data scenario, as deep learning typically requires massive data to perform well. To address this issue, a multitask learning model is proposed, namely, PCBMTL, that can simultaneously learn the classification and segmentation tasks under low‐data regimes. By acquiring the segmentation knowledge, classification performance is substantially improved with few samples. To facilitate the study, a soldering defect image dataset, namely, PCBSPDefect, is built. It focuses on the dual in‐line packages (DIP) at the PCB back side, DIP at the PCB front side, and flat flexible cables. Experimental results show that the proposed PCBMTL outperforms the best existing approaches by over 5–17% of average accuracy for different datasets.