Elucidation of Adhesive Interaction between the Epoxy Molding Compound and Cu Lead Frames
Naoaki Tsurumi, Yuta Tsuji, Noriyuki Masago, Kazunari Yoshizawa
Abstract
O surface stabilized was 0.5 eV higher than in the case of the Cu surface.
Topics & Concepts
AdhesiveEpoxyMaterials scienceMolding (decorative)Composite materialAdhesionCuring (chemistry)Surface energyHydrogen bondMoleculeChemistryLayer (electronics)Organic chemistryElectronic Packaging and Soldering TechnologiesEpoxy Resin Curing ProcessesMechanical Behavior of Composites