Fatigue behaviour analysis of thermal cyclic loading for through-silicon via structures based on backstress stored energy density
Hongjiang Qian, Zhiyong Huang, Haidong Fan, Yuexing Wang, Linwei Cao, Qingyun Zhu, Chaoquan Zhao
Topics & Concepts
Materials scienceGrain boundaryFinite element methodElectron backscatter diffractionMicroscale chemistryStrain energy density functionThrough-silicon viaThermalAnisotropyComposite materialMicrostructureTemperature gradientSiliconStructural engineeringMetallurgyOpticsEngineeringPhysicsQuantum mechanicsMeteorologyMathematicsMathematics educationAdvanced Surface Polishing Techniques3D IC and TSV technologiesAdvanced ceramic materials synthesis