Progress of High Strength and High Thermal Conductivity Si<sub>3</sub>N<sub>4</sub> Ceramics for Power Module Packaging
Shi FU, Zengchao Yang, Jiangtao Li
Topics & Concepts
Materials scienceThermal conductivityCeramicComposite materialEngineering physicsThermalThermodynamicsEngineeringPhysicsAdvanced ceramic materials synthesisMXene and MAX Phase MaterialsAdvanced materials and composites