The bonding mechanism of rock and cement paste backfill interface under high temperature curing
Chi Zhang, Jie Wang, Weidong Song, Jianxin Fu
Topics & Concepts
Curing (chemistry)Materials scienceCementComposite materialMechanism (biology)Interface (matter)Geotechnical engineeringGeologyWettingEpistemologyPhilosophySessile drop techniqueTailings Management and PropertiesRock Mechanics and ModelingGrouting, Rheology, and Soil Mechanics