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On Backside Probing Techniques and Their Emerging Security Threats

Liton Kumar Biswas, Leonidas Lavdas, Mir Tanjidur Rahman, Mark Tehranipoor, Navid Asadizanjani

2022IEEE Design and Test10 citationsDOI

Abstract

Various probing methodologies have been developed in the semiconductor industry to perform failure analysis of an integrated circuit. However, these probing techniques can be misused to launch security attacks and extract sensitive information from the hardware. In this article, the authors provide an overview of such attacks and present probable countermeasures and their limitations.

Topics & Concepts

Computer securitySemiconductor industryComputer scienceHardware security moduleRisk analysis (engineering)EngineeringCryptographyBusinessManufacturing engineeringPhysical Unclonable Functions (PUFs) and Hardware SecurityIntegrated Circuits and Semiconductor Failure AnalysisElectrostatic Discharge in Electronics
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