Modulation of ultrafast laser-induced modified structure inside silicon carbide for thin wafer dicing
Yubiao Zhou, Fu Liu, Shiyu Cao, Renchao Liang, Yi Zhang
Topics & Concepts
Wafer dicingMaterials scienceWaferSilicon carbideOptoelectronicsUltrashort pulseLaserLaser ablationModulation (music)Thin filmComposite materialOpticsNanotechnologyPhilosophyPhysicsAestheticsLaser Material Processing TechniquesAdvanced Surface Polishing TechniquesSurface Roughness and Optical Measurements