Sub-1 min Sinter-Bonding Technique in Air Using Modified Cu Dendritic Particles for Formation of a High-Temperature Sustainable Bondline
Eun Byeol Choi, Jong‐Hyun Lee
Topics & Concepts
Materials scienceSinteringComposite materialVoid (composites)Solid mechanicsShear strength (soil)Soil scienceSoil waterEnvironmental scienceElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAluminum Alloys Composites Properties