In-situ characterization of moisture absorption and hygroscopic swelling of an epoxy molding compound for electronic packaging
Ying He, Mohammad Kabiri
Topics & Concepts
Materials scienceComposite materialMoistureIsothermal processSwellingThermal diffusivityMolding (decorative)Relative humidityAbsorption of waterDiffusionFick's laws of diffusionEpoxyAbsorption (acoustics)HumidityWater contentThermogravimetric analysisAnalytical Chemistry (journal)ChemistryThermodynamicsChromatographyGeotechnical engineeringPhysicsOrganic chemistryEngineeringElectronic Packaging and Soldering TechnologiesMechanical Behavior of Composites3D IC and TSV technologies